The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 04, 2022

Filed:

Jul. 26, 2019
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Michiko Nakaya, Miyagi, JP;

Toru Hisamatsu, Miyagi, JP;

Shinya Ishikawa, Miyagi, JP;

Sho Kumakura, Miyagi, JP;

Masanobu Honda, Miyagi, JP;

Yoshihide Kihara, Miyagi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/455 (2006.01); H01J 37/32 (2006.01); H01L 21/02 (2006.01); H01L 21/311 (2006.01); C23C 16/52 (2006.01);
U.S. Cl.
CPC ...
C23C 16/45536 (2013.01); C23C 16/45544 (2013.01); C23C 16/45553 (2013.01); C23C 16/52 (2013.01); H01J 37/32834 (2013.01); H01L 21/0228 (2013.01); H01L 21/31116 (2013.01); H01L 21/31144 (2013.01); H01J 2237/3321 (2013.01); H01J 2237/3341 (2013.01);
Abstract

A plasma processing method executed by a plasma processing apparatus in the present disclosure includes a first step and a second step. In the first step, the plasma processing apparatus forms a first film on the side walls of an opening in the processing target, the first film having different thicknesses along a spacing between pairs of side walls facing each other. In the second step, the plasma processing apparatus forms a second film by performing a film forming cycle once or more times after the first step, the second film having different thicknesses along the spacing between the pairs of side walls facing each other.


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