The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 20, 2022

Filed:

Mar. 17, 2021
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Wei Dou, Sunnyvale, CA (US);

Yong Cao, San Jose, CA (US);

Mingdong Li, Santa Clara, CA (US);

Shane Lavan, Santa Clara, CA (US);

Jothilingam Ramalingam, Milpitas, CA (US);

Chengyu Liu, San Jose, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/14 (2006.01); H01J 37/32 (2006.01); C23C 14/34 (2006.01); C23C 14/54 (2006.01); C23C 14/06 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32504 (2013.01); C23C 14/0652 (2013.01); C23C 14/14 (2013.01); C23C 14/34 (2013.01); C23C 14/54 (2013.01); H01J 2237/332 (2013.01);
Abstract

Embodiments of methods and apparatus for reducing particle formation in physical vapor deposition (PVD) chambers are provided herein. In some embodiments, a method of reducing particle formation in a PVD chamber includes: performing a plurality of first deposition processes on a corresponding series of substrates disposed on a substrate support in the PVD chamber, wherein the PVD chamber includes a cover ring disposed about the substrate support and having a texturized outer surface, and wherein a silicon nitride (SiN) layer having a first thickness is deposited onto the texturized outer surface during each of the plurality of first deposition processes; and performing a second deposition process on the cover ring between subsets of the plurality of first deposition processes to deposit an amorphous silicon layer having a second thickness onto an underlying silicon nitride (SiN) layer.


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