The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 09, 2022

Filed:

Oct. 18, 2018
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Adib Khan, Cupertino, CA (US);

Shankar Venkataraman, San Jose, CA (US);

Jay D. Pinson, II, San Jose, CA (US);

Jang-Gyoo Yang, San Jose, CA (US);

Nitin Krishnarao Ingle, San Jose, CA (US);

Qiwei Liang, Fremont, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 16/56 (2006.01); C23C 16/44 (2006.01); C23C 16/46 (2006.01); C23C 16/455 (2006.01); H01L 21/687 (2006.01); H01L 21/67 (2006.01); H01L 21/677 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
C23C 16/56 (2013.01); C23C 16/44 (2013.01); C23C 16/45565 (2013.01); C23C 16/46 (2013.01); H01L 21/02282 (2013.01); H01L 21/6719 (2013.01); H01L 21/67126 (2013.01); H01L 21/67742 (2013.01); H01L 21/67778 (2013.01); H01L 21/68742 (2013.01); H01L 21/68785 (2013.01);
Abstract

Embodiments of the present disclosure generally relate to a batch processing chamber that is adapted to simultaneously cure multiple substrates at one time. The batch processing chamber includes multiple processing sub-regions that are each independently temperature controlled. The batch processing chamber may include a first and a second sub-processing region that are each serviced by a substrate transport device external to the batch processing chamber. In addition, a slotted cover mounted on the loading opening of the batch curing chamber reduces the effect of ambient air entering the chamber during loading and unloading.


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