The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 02, 2022

Filed:

Sep. 09, 2020
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Kazunaga Ono, Yamanashi, JP;

Atsushi Gomi, Yamanashi, JP;

Tatsuo Hatano, Yamanashi, JP;

Yasuhiro Otagiri, Yamanashi, JP;

Tomoyuki Fujihara, Yamanashi, JP;

Yuuki Motomura, Yamanashi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/34 (2006.01); H01L 21/203 (2006.01); C23C 14/34 (2006.01);
U.S. Cl.
CPC ...
H01J 37/3447 (2013.01); C23C 14/3464 (2013.01); H01J 37/3426 (2013.01); H01L 21/203 (2013.01);
Abstract

A sputtering method including: performing a pre-sputtering by emitting sputter particles from a target provided in a sputtering apparatus in a state where the target is shielded by a shielding portion of a shutter provided closed to the target to be capable of opening/closing the target; and, after the pre-sputtering, performing a main-sputtering by emitting the sputter particles from the target in a state where an opening of the shutter is aligned with the target thereby depositing the sputter particles on a substrate. When the pre-sputtering and the main-sputtering are repeatedly performed, a shutter position is changed during the pre-sputtering so as to change a position of the shielding portion aligned with the target.


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