The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2022

Filed:

Jun. 28, 2019
Applicant:

Asml Netherlands B.v., Veldhoven, NL;

Inventors:

Miguel Garcia Granda, Veldhoven, NL;

Steven Erik Steen, Veldhoven, NL;

Eric Jos Anton Brouwer, Weert, NL;

Bart Peter Bert Segers, Tessenderlo, BE;

Pierre-Yves Jerome Yvan Guittet, Veldhoven, NL;

Frank Staals, Eindhoven, NL;

Paulus Jacobus Maria Van Adrichem, Wijchen, NL;

Assignee:

ASML Netherlands B.V., Veldhoven, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/20 (2006.01); G03F 1/44 (2012.01); G03F 1/84 (2012.01);
U.S. Cl.
CPC ...
G03F 7/70683 (2013.01); G03F 1/44 (2013.01); G03F 1/84 (2013.01); G03F 7/70283 (2013.01); G03F 7/70616 (2013.01); G03F 7/70625 (2013.01); G03F 7/70641 (2013.01);
Abstract

Disclosed is a method of determining a characteristic of interest, in particular focus, relating to a structure on a substrate formed by a lithographic process, and an associated patterning device and lithographic system. The method comprises forming a modified substrate feature on the substrate using a corresponding modified reticle feature on a patterning device, the modified substrate feature being formed for a primary function other than metrology, more specifically for providing a support for a vertically integrated structure. The modified reticle feature is such that said modified substrate feature is formed with a geometry dependent on the characteristic of interest during formation. The modified substrate feature can be measured to determine said characteristic of interest.


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