The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 05, 2022

Filed:

Sep. 30, 2020
Applicant:

Fei Company, Hillsboro, OR (US);

Inventors:

Pavel Potocek, Eindhoven, NL;

Milo{hacek over (s)} Hovorka, Brno, CZ;

Maurice Peemen, Eindhoven, NL;

Luká{hacek over (s)} Hübner, Brno, CZ;

Assignee:

FEI Company, Hillsboro, OR (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); H01J 37/28 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32926 (2013.01); H01J 37/28 (2013.01); H01J 2237/2004 (2013.01); H01J 2237/226 (2013.01);
Abstract

Methods and systems for generating high resolution reconstructions of 3D samples imaged using slice and view processes where the electron interaction depth of the imaging beam is greater than slice thicknesses. Data obtained via such slice and view processes is enhanced with a depth blur reducing algorithm, that is configured to reduce depth blur caused by portions of the first data and second data that are resultant from electron interactions outside the first layer and second layer, respectively, to create enhanced first data and second enhanced data. A high-resolution 3D reconstruction of the sample is then generated using the enhanced first data and the enhanced second data. In some embodiments, the depth blur reducing algorithm may be selected from a set of such algorithms that have been individually configured for certain microscope conditions, sample conditions, or a combination thereof.


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