The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 05, 2022

Filed:

Sep. 23, 2019
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Kazuya Hisano, Koshi, JP;

Akiko Kiyotomi, Koshi, JP;

Yasuaki Noda, Koshi, JP;

Keisuke Hamamoto, Koshi, JP;

Tadashi Nishiyama, Koshi, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01B 11/16 (2006.01); H01L 21/687 (2006.01); H01L 21/66 (2006.01); H01L 21/67 (2006.01); G06T 7/70 (2017.01); G06T 7/00 (2017.01); G06T 7/50 (2017.01);
U.S. Cl.
CPC ...
G01B 11/16 (2013.01); G06T 7/001 (2013.01); G06T 7/50 (2017.01); G06T 7/70 (2017.01); H01L 21/67288 (2013.01); H01L 21/68764 (2013.01); H01L 22/12 (2013.01); G01B 2210/56 (2013.01); G06T 2207/30148 (2013.01);
Abstract

A substrate inspection method includes a first process of taking, while rotating a holding table where a reference substrate is held, an image of an end surface of the reference substrate; a second process of obtaining shape data on the end surface of the reference substrate by processing the image; a third process of taking, while rotating the holding table where a target substrate is held, an image of an end surface of the target substrate; a fourth process of obtaining shape data on the end surface of the target substrate by processing the image; and a fifth process of calculating a warpage amount of the target substrate by obtaining a difference between the shape data obtained in the second process and in the fourth process under a condition that a rotational position of the holding table in the first process coincides with that in the third process.


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