The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2022
Filed:
Aug. 09, 2017
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Kevin L. Lin, Beaverton, OR (US);
Paul B. Fischer, Portland, OR (US);
Han Wui Then, Portland, OR (US);
Sansaptak Dasgupta, Hillsboro, OR (US);
Marko Radosavljevic, Portland, OR (US);
Ibrahim Ban, Beaverton, OR (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/10 (2006.01); H01L 21/764 (2006.01); H01L 27/12 (2006.01); H01L 21/3065 (2006.01); H01L 21/762 (2006.01); H01L 21/84 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 29/20 (2006.01); H01L 29/205 (2006.01); H01L 29/423 (2006.01); H01L 29/778 (2006.01);
U.S. Cl.
CPC ...
H01L 29/1079 (2013.01); H01L 21/3065 (2013.01); H01L 21/764 (2013.01); H01L 21/76289 (2013.01); H01L 21/84 (2013.01); H01L 23/528 (2013.01); H01L 23/5227 (2013.01); H01L 27/1203 (2013.01); H01L 29/2003 (2013.01); H01L 29/205 (2013.01); H01L 29/42376 (2013.01); H01L 29/7786 (2013.01);
Abstract
Disclosed herein are integrated circuit (IC) components with substrate cavities, as well as related techniques and assemblies. In some embodiments, an IC component may include a substrate, a device layer on the substrate, a plurality of interconnect layers on the device layer, and a cavity in the substrate.