The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 2022
Filed:
Aug. 16, 2019
Applicant:
Kla Corporation, Milpitas, CA (US);
Inventors:
Junqing Huang, Fremont, CA (US);
Hucheng Lee, Cupertino, CA (US);
Sangbong Park, Dublin, CA (US);
Xiaochun Li, San Jose, CA (US);
Assignee:
KLA CORPORATION, Milpitas, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2006.01); G06T 7/00 (2017.01); H01L 27/108 (2006.01); H01L 27/11556 (2017.01); G06T 7/11 (2017.01); G01N 21/95 (2006.01); G01N 21/956 (2006.01); H01L 27/11582 (2017.01);
U.S. Cl.
CPC ...
G06T 7/0006 (2013.01); G01N 21/9501 (2013.01); G01N 21/956 (2013.01); G06T 7/11 (2017.01); H01L 27/10844 (2013.01); H01L 27/11556 (2013.01); H01L 27/11582 (2013.01); G06T 2207/30148 (2013.01);
Abstract
With the disclosed systems and methods for DRAM and 3D NAND inspection, an image of the wafer is received based on the output for an inspection tool. Geometric measurements of a design of a plurality of memory devices on the wafer are received. A care area with higher inspection sensitivity is determined based on the geometric measurements.