The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 01, 2022

Filed:

Dec. 07, 2017
Applicant:

Kla-tencor Corporation, Milpitas, CA (US);

Inventors:

Martin Plihal, Pleasanton, CA (US);

Erfan Soltanmohammadi, Campbell, CA (US);

Saravanan Paramasivam, Chennai, IN;

Sairam Ravu, Chennai, IN;

Ankit Jain, Ballston Spa, NY (US);

Prasanti Uppaluri, Saratoga, CA (US);

Vijay Ramachandran, Sunnyvale, CA (US);

Assignee:

KLA-Tencor Corporation, Milpitas, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 21/95 (2006.01); H01L 21/67 (2006.01); G05B 19/418 (2006.01); G01N 21/88 (2006.01); G06T 7/00 (2017.01); H01J 37/22 (2006.01); H01J 37/28 (2006.01); G01N 23/04 (2018.01); H01L 21/66 (2006.01); G06N 7/00 (2006.01);
U.S. Cl.
CPC ...
G01N 21/9501 (2013.01); G01N 21/8851 (2013.01); G05B 19/41875 (2013.01); G06T 7/001 (2013.01); G06T 7/0004 (2013.01); G01N 23/04 (2013.01); G05B 2219/32186 (2013.01); G05B 2219/32196 (2013.01); G06N 7/005 (2013.01); H01J 37/222 (2013.01); H01J 37/28 (2013.01); H01J 2237/22 (2013.01); H01J 2237/2817 (2013.01); H01L 21/67288 (2013.01); H01L 22/20 (2013.01);
Abstract

Wafer inspection with stable nuisance rates and defect of interest capture rates are disclosed. This technique can be used for discovery of newly appearing defects that occur during the manufacturing process. Based on a first wafer, defects of interest are identified based on the classified filtered inspection results. For each remaining wafer, the defect classifier is updated and defects of interest in the next wafer are identified based on the classified filtered inspection results.


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