The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 14, 2021

Filed:

May. 14, 2019
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Itaru Kanno, Tokyo, JP;

Hiromi Kiyose, Hillsboro, OR (US);

Gentaro Goshi, Koshi, JP;

Naohiko Hamamura, Koshi, JP;

Takuro Masuzumi, Koshi, JP;

Kenji Sekiguchi, Koshi, JP;

Satoru Tanaka, Koshi, JP;

Teruomi Minami, Koshi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F26B 3/34 (2006.01); H01L 21/02 (2006.01); F26B 3/28 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02101 (2013.01); F26B 3/28 (2013.01); H01L 21/67034 (2013.01);
Abstract

A substrate processing method capable of suppressing particles from remaining on a surface of a substrate is provided. In the substrate processing method, a liquid film of a protection liquid is formed on the surface of the substrate, and the substrate is dried by using a supercritical fluid so that the protection liquid is removed from the surface of the substrate. After the substrate is dried, the particles remaining on the surface of the substrate is removed.


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