The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 16, 2021

Filed:

Sep. 27, 2018
Applicant:

Versum Materials Us, Llc, Tempe, AZ (US);

Inventors:

Jhih Kuei Ge, Chupei, TW;

Yi-Chia Lee, Danshu, TW;

Wen Dar Liu, Chupei, TW;

Chi-Hsien Kuo, Chupei, TW;

Assignee:

VERSUM MATERIALS US, LLC, Tempe, AZ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C11D 3/28 (2006.01); C11D 3/30 (2006.01); C11D 3/34 (2006.01); C11D 3/43 (2006.01); C11D 7/32 (2006.01); C11D 7/50 (2006.01); G03F 7/42 (2006.01); H01L 21/311 (2006.01); H01L 21/02 (2006.01); C11D 3/20 (2006.01); C11D 1/722 (2006.01); C11D 1/72 (2006.01); C11D 3/32 (2006.01); C11D 3/33 (2006.01); B08B 3/08 (2006.01);
U.S. Cl.
CPC ...
G03F 7/425 (2013.01); B08B 3/08 (2013.01); C11D 1/72 (2013.01); C11D 1/722 (2013.01); C11D 3/2068 (2013.01); C11D 3/2075 (2013.01); C11D 3/2082 (2013.01); C11D 3/2086 (2013.01); C11D 3/28 (2013.01); C11D 3/30 (2013.01); C11D 3/32 (2013.01); C11D 3/33 (2013.01); C11D 3/43 (2013.01); G03F 7/426 (2013.01); H01L 21/02057 (2013.01); H01L 21/31133 (2013.01); H01L 21/02071 (2013.01);
Abstract

Stripping solutions that may replace an etching resist ashing process are provided. The stripping solutions are useful for fabricating circuits and/or forming electrodes and/or packaging/bumping applications on semiconductor devices for semiconductor integrated circuits with good photoresist removal efficiency and with low silicon oxide etch rate and low metal etch rates. Methods for their use are similarly provided. The preferred stripping agents contain polar aprotic solvent, water, hydroxylamine, corrosion inhibitor, quaternary ammonium hydroxide and optional surfactant. Further provided are integrated circuit devices and electronic interconnect structures prepared according to these methods.


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