The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 26, 2021
Filed:
Oct. 12, 2018
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Chen-Hua Yu, Hsinchu, TW;
Keng-Han Lin, Hsinchu, TW;
Hung-Jui Kuo, Hsinchu, TW;
Hui-Jung Tsai, Hsinchu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 33/62 (2010.01); H01L 25/075 (2006.01); H01L 33/10 (2010.01); H01L 33/46 (2010.01); H01L 33/52 (2010.01); H01S 5/022 (2021.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 23/5226 (2013.01); H01L 25/0753 (2013.01); H01L 33/105 (2013.01); H01L 33/465 (2013.01); H01L 33/52 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0025 (2013.01); H01L 2933/0033 (2013.01); H01S 5/022 (2013.01);
Abstract
In an embodiment, a method includes: connecting a light emitting diode to a substrate; encapsulating the light emitting diode with a photosensitive encapsulant; forming a first opening through the photosensitive encapsulant adjacent the light emitting diode; and forming a conductive via in the first opening.