The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 26, 2021

Filed:

Feb. 18, 2020
Applicants:

Global Unichip Corporation, Hsinchu, TW;

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Chih-Chieh Liao, Hsinchu, TW;

Yu-Min Sun, Hsinchu, TW;

Chih-Feng Cheng, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 1/04 (2006.01); G01R 1/067 (2006.01); G01R 1/073 (2006.01); G01R 31/28 (2006.01); H01R 12/00 (2006.01);
U.S. Cl.
CPC ...
G01R 1/07342 (2013.01); G01R 1/07364 (2013.01);
Abstract

A probe card module including a probe card assembly and a strengthening structure is provided. The probe card assembly includes a first surface, a second surface opposite to the first surface, and a plurality of probes protruding from the first surface. The second surface includes a central zone and a peripheral zone surrounding the central zone. Projections of the probes on the second surface are located at the central zone. The strengthening structure is disposed on the second surface and includes two support bases which protrude from the peripheral zone and are away from each other, and the strengthening structure also includes an arc-shaped reinforcement assembly connected to the two support bases, where the arc-shaped reinforcement assembly protrudes toward and leans against the central zone.


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