The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 2021
Filed:
Jul. 26, 2018
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Kuo-Chiang Ting, Hsinchu, TW;
Tu-Hao Yu, Hsin-Chu, TW;
Ting-Yu Yeh, Hsinchu, TW;
Chia-Hao Hsu, Hsinchu, TW;
Weiming Chris Chen, Taipei, TW;
Wan-Yu Lee, Taipei, TW;
Yu-Jie Su, Kaohsiung, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Abstract
A semiconductor package structure includes a first package, a second package over the first package, a plurality of connectors between the first package and the second package and a plurality of baffle structures between the first package and the second package. The second package includes a bonding region and a periphery region surrounding the bonding region. The connectors are disposed in the bonding region to provide electrical connections between the first package and the second package. The baffle structures are disposed in the periphery region and are separated from each other.