Company Filing History:
Years Active: 2021
Title: Yu-Jie Su: Innovator in Semiconductor Packaging
Introduction: Yu-Jie Su is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the area of packaging structures. His innovative approach has led to the development of a unique semiconductor package structure that enhances the efficiency and reliability of electronic devices.
Latest Patents: Yu-Jie Su holds a patent for a semiconductor package structure and method for manufacturing the same. This patent describes a semiconductor package structure that includes a first package, a second package positioned over the first package, and a plurality of connectors between the two packages. Additionally, it features a plurality of baffle structures that are strategically placed between the first and second packages. The second package comprises a bonding region and a periphery region surrounding the bonding region. The connectors are located in the bonding region to facilitate electrical connections, while the baffle structures are situated in the periphery region and are separated from one another. This innovative design aims to improve the overall performance of semiconductor devices.
Career Highlights: Yu-Jie Su is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work at this esteemed company has allowed him to collaborate with other talented professionals and contribute to groundbreaking advancements in semiconductor technology.
Collaborations: Some of Yu-Jie Su's notable coworkers include Kuo-Chiang Ting and Tu-Hao Yu. Their collective expertise and teamwork have played a crucial role in driving innovation within their projects.
Conclusion: Yu-Jie Su's contributions to semiconductor packaging technology exemplify the importance of innovation in the electronics industry. His patent and work at Taiwan Semiconductor Manufacturing Company Limited highlight his commitment to advancing technology and improving device performance.