The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 28, 2021

Filed:

Aug. 08, 2018
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Kento Tsukano, Koshi, JP;

Gentaro Goshi, Koshi, JP;

Takuro Masuzumi, Koshi, JP;

Hiromi Kiyose, Koshi, JP;

Shogo Fukui, Koshi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/67 (2006.01); B08B 3/10 (2006.01); B08B 3/04 (2006.01); B08B 3/08 (2006.01); H01L 21/687 (2006.01); H01L 21/677 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02101 (2013.01); B08B 3/041 (2013.01); B08B 3/08 (2013.01); B08B 3/10 (2013.01); H01L 21/6719 (2013.01); H01L 21/67028 (2013.01); H01L 21/67034 (2013.01); H01L 21/67051 (2013.01); H01L 21/67126 (2013.01); H01L 21/67748 (2013.01); H01L 21/68764 (2013.01);
Abstract

In a substrate processing method, as a liquid film forming process, a liquid film of a processing liquid covering a surface of a substrate W is formed by supplying the processing liquid onto the surface of the substrate W while rotating the substrate W at a first rotation number. After the liquid film forming process, as a supply stopping process, a rotation number of the substrate W is set to be of a value equal to or less than the first rotation number and a supply of the processing liquid onto the substrate W is stopped. After the supply stopping process, as a liquid amount adjusting process, a liquid amount of the processing liquid forming the liquid film is reduced by setting the rotation number of the substrate W to a rotation number larger than the first rotation number.


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