The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 2021
Filed:
Oct. 04, 2019
Applicant:
Versum Materials Us, Llc, Tempe, AZ (US);
Inventors:
James Matthew Henry, Fountain Hill, AZ (US);
Hongjun Zhou, Chandler, AZ (US);
Krishna P. Murella, Phoenix, AZ (US);
Dnyanesh Chandrakant Tamboli, Gilbert, AZ (US);
Joseph Rose, Chandler, AZ (US);
Assignee:
Versum Materials US, LLC, Tempe, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); B24B 37/24 (2012.01); H01L 21/306 (2006.01); C09G 1/00 (2006.01); C09G 1/04 (2006.01); C09K 3/14 (2006.01); B24B 1/00 (2006.01); C09K 13/06 (2006.01); B24B 37/04 (2012.01); H01L 21/304 (2006.01); H01L 21/321 (2006.01); C09G 1/06 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); B24B 1/00 (2013.01); B24B 37/044 (2013.01); B24B 37/245 (2013.01); C09G 1/00 (2013.01); C09G 1/04 (2013.01); C09G 1/06 (2013.01); C09K 3/1454 (2013.01); C09K 3/1463 (2013.01); C09K 13/06 (2013.01); H01L 21/304 (2013.01); H01L 21/30625 (2013.01); H01L 21/3212 (2013.01);
Abstract
Chemical Mechanical Planarization (CMP) polishing compositions comprising abrasive particles and additives to boost removal rates of films comprising elemental silicon such as poly-silicon and Silicon-Germanium.