The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 31, 2021
Filed:
Mar. 14, 2019
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Fan-Yu Min, Kaohsiung, TW;
Chao-Hung Weng, Kaohsiung, TW;
Wei-Hang Tai, Kaohsiung, TW;
Chen-Hung Lee, Kaohsiung, TW;
Yu-Yuan Yeh, Kaohsiung, TW;
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Abstract
A semiconductor package structure includes a conductive structure, a first semiconductor chip, a second semiconductor chip, a first encapsulant and an upper semiconductor chip. The first semiconductor chip is electrically connected to the conductive structure. The first semiconductor chip includes at least one first conductive element disposed adjacent to a second surface thereof. The second semiconductor chip is electrically connected to the conductive structure and disposed next to the first semiconductor chip. The second semiconductor chip includes at least one second conductive element disposed adjacent to a second surface thereof. The first encapsulant is disposed on the conductive structure to cover the first semiconductor chip and the second semiconductor chip. The first conductive element and the second conductive element are exposed from the first encapsulant. The upper semiconductor chip is disposed on the first encapsulant and electrically connected to the first conductive element and the second conductive element.