Chen-Hung Lee

Title: Innovations of Inventor Chen-Hung Lee

Introduction

Chen-Hung Lee is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 3 patents. His work focuses on innovative package structures and manufacturing methods that enhance the performance and efficiency of electronic devices.

Latest Patents

One of Chen-Hung Lee's latest patents is titled "Package structure and method for manufacturing the same." This invention provides a package structure that includes a wiring structure, a first electronic device, and a second electronic device. The first electronic device is positioned on the wiring structure, while the second electronic device is also placed on the same structure, side by side. Notably, the gap between these two devices is greater than or equal to about 150 μm.

Another significant patent is the "Semiconductor package structure and method for manufacturing the same." This patent describes a semiconductor package structure that consists of a conductive structure, a first semiconductor chip, a second semiconductor chip, a first encapsulant, and an upper semiconductor chip. The first semiconductor chip is electrically connected to the conductive structure and includes at least one first conductive element adjacent to its second surface. The second semiconductor chip is also connected to the conductive structure and is placed next to the first semiconductor chip, featuring at least one second conductive element. The first encapsulant covers both semiconductor chips, with the conductive elements exposed, while the upper semiconductor chip is connected to these elements.

Career Highlights

Chen-Hung Lee is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to innovate in semiconductor technology. His expertise in package structures has positioned him as a key player in the industry, contributing to advancements that improve electronic device functionality.

Collaborations

Throughout his career, Chen-Hung Lee has collaborated with notable colleagues, including Fan-Yu Min and Wei-Hang Tai. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies in semiconductor packaging.

Conclusion

In summary, Chen-Hung Lee is a distinguished inventor whose work in semiconductor packaging has led to multiple patents and significant advancements in the field. His contributions continue to shape the future of electronic devices, making him a valuable asset to the industry.