Company Filing History:
Years Active: 2021
Title: Innovations of Chao-Hung Weng in Semiconductor Technology
Introduction
Chao-Hung Weng is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on innovative semiconductor package structures and methods for manufacturing them.
Latest Patents
Weng's latest patents include a semiconductor package structure and a method for manufacturing the same. The semiconductor package structure features a conductive structure, a first semiconductor chip, a second semiconductor chip, a first encapsulant, and an upper semiconductor chip. The first semiconductor chip is electrically connected to the conductive structure and includes at least one first conductive element adjacent to its second surface. The second semiconductor chip is also electrically connected to the conductive structure and is positioned next to the first semiconductor chip, containing at least one second conductive element. The first encapsulant covers both semiconductor chips, with the conductive elements exposed. Additionally, Weng has developed a semiconductor package device and a method of forming the package body, which includes a first mold, a second mold, and a support element for molding semiconductor devices.
Career Highlights
Chao-Hung Weng is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to innovate in semiconductor packaging technologies. His work has been instrumental in advancing the efficiency and effectiveness of semiconductor devices.
Collaborations
Weng collaborates with talented coworkers, including Fan-Yu Min and Wei-Hang Tai, contributing to a dynamic team focused on semiconductor advancements.
Conclusion
Chao-Hung Weng's contributions to semiconductor technology through his patents and work at Advanced Semiconductor Engineering, Inc. highlight his role as a key innovator in the field. His inventions are paving the way for future advancements in semiconductor packaging.