Company Filing History:
Years Active: 2021-2022
Title: The Innovative Contributions of Fan-Yu Min
Introduction
Fan-Yu Min is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 4 patents. His work focuses on enhancing the efficiency and functionality of electronic devices through innovative packaging solutions.
Latest Patents
Fan-Yu Min's latest patents include a package structure and a method for manufacturing the same. This package structure features a wiring structure that accommodates a first electronic device and a second electronic device, which are positioned side by side with a gap of at least 150 micrometers between them. Another notable patent is for a semiconductor package structure that includes a conductive structure, a first semiconductor chip, a second semiconductor chip, a first encapsulant, and an upper semiconductor chip. This design allows for effective electrical connections while ensuring that the conductive elements are exposed for optimal performance.
Career Highlights
Fan-Yu Min is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to innovate in the semiconductor industry. His expertise in packaging technology has positioned him as a key player in the development of advanced electronic solutions.
Collaborations
Throughout his career, Fan-Yu Min has collaborated with notable colleagues such as Chen-Hung Lee and Chao-Hung Weng. These partnerships have fostered a creative environment that encourages the exchange of ideas and advancements in technology.
Conclusion
Fan-Yu Min's contributions to semiconductor packaging demonstrate his commitment to innovation and excellence in the field. His patents reflect a deep understanding of electronic device functionality and a drive to improve technology for future applications.