The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 13, 2021

Filed:

Dec. 01, 2019
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Luping Li, Santa Clara, CA (US);

Shih Chung Chen, Cupertino, CA (US);

Kazuya Daito, Milipitas, CA (US);

Lin Dong, San Jose, CA (US);

Zhebo Chen, San Jose, CA (US);

Yixiong Yang, Fremont, CA (US);

Steven Hung, Sunnyvale, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02247 (2013.01); H01L 21/0217 (2013.01); H01L 21/02205 (2013.01); H01L 21/31111 (2013.01);
Abstract

Methods and apparatus for forming a semiconductor structure with a scaled effective oxide thickness is disclosed. In embodiments, a method includes depositing amorphous silicon capping layer having a first surface atop a first surface of a titanium nitride (TiN) layer, wherein the titanium nitride layer is atop a first surface of a high-k dielectric layer disposed within a film stack; contacting the first surface of the amorphous silicon capping layer with a nitrogen containing gas; and annealing the film stack.


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