The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 15, 2021
Filed:
Nov. 14, 2019
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Jui-Pin Hung, Hsinchu, TW;
Jing-Cheng Lin, Hsinchu, TW;
Po-Hao Tsai, Zhongli, TW;
Yi-Jou Lin, Hsinchu, TW;
Shuo-Mao Chen, New Taipei, TW;
Chiung-Han Yeh, Tainan, TW;
Der-Chyang Yeh, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
An interconnect structure and a method of forming an interconnect structure are provided. The interconnect structure is formed over a carrier substrate, upon which a die may also be attached. Upon removal of the carrier substrate and singulation, a first package is formed. A second package may be attached to the first package, wherein the second package may be electrically coupled to through vias formed in the first package.