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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11034859 B1

PDFFull Text
Date of Patent:
Jun. 15, 2021

Filed:

Mar. 11, 2019

Barrier ruthenium chemical mechanical polishing slurry

Applicant:

Fujifilm Electronic Materials U.s.a., Inc., North Kingstown, RI (US);

Inventors:

David (Tawei) Lin, Chandler, AZ (US);

Bin Hu, Chandler, AZ (US);

Liqing (Richard) Wen, Mesa, AZ (US);

Yannan Liang, Gilbert, AZ (US);

Ting-Kai Huang, Taiwan, CN;

Assignee:

FUJIFILM ELECTRONIC MATERIALS U.S.A., INC., North Kingstown, RI (US);

Attorney:

Ohlandt, Greeley, Ruggiero and Perle, LLP

Primary Examiner:

Jiong-Ping Lu

Int. Cl.
CPC ...
C09G 1/02 (2006.01); H01L 21/321 (2006.01); C09K 3/14 (2006.01); C09G 1/06 (2006.01); C09K 13/06 (2006.01); C09G 1/04 (2006.01); B24B 1/00 (2006.01); C09G 1/00 (2006.01); B24B 37/04 (2012.01); H01L 21/306 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); B24B 1/00 (2013.01); B24B 37/044 (2013.01); C09G 1/00 (2013.01); C09G 1/04 (2013.01); C09G 1/06 (2013.01); C09K 3/1454 (2013.01); C09K 3/1463 (2013.01); C09K 13/06 (2013.01); H01L 21/30625 (2013.01); H01L 21/3212 (2013.01);
Abstract

A slurry for polishing surfaces or substrates that at least partially comprise ruthenium and copper, wherein the slurry includes an alkali hydroxide, oxygenated halogen compound, and a halogen alkyl benzotriazole. The slurry may further include abrasive, acid(s), and, optionally, an alkoxylated alcohol. With these components, the slurry exhibits a high ruthenium to copper removal rate ratio.

Find Patent Forward Citations

Lin, David (Tawei). (2021). Barrier ruthenium chemical mechanical polishing slurry (U.S. Patent No. 11034859). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11034859

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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