The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 08, 2021
Filed:
Feb. 16, 2017
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Mill-Jer Wang, Hsinchu, TW;
Chi-Che Wu, Hsinchu, TW;
Hung-Chih Lin, Hsinchu, TW;
Hao Chen, New Taipei, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 1/04 (2006.01); H01L 25/10 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
G01R 1/0466 (2013.01); H01L 25/105 (2013.01); H05K 1/0268 (2013.01); G01R 1/0483 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 2224/16225 (2013.01); H01L 2225/1041 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/15174 (2013.01); H05K 1/111 (2013.01); H05K 2201/09227 (2013.01); H05K 2201/10734 (2013.01);
Abstract
A semiconductor device includes a circuit board, a semiconductor package, and a contact interface. The semiconductor package is mounted on the circuit board. The semiconductor package includes a plurality of conductive bumps with a first pitch. The contact interface is electrically connected to the circuit board. The contact interface includes a plurality of first contact pads with a second pitch substantially the same as the first pitch. The first contact pads are separated from the conductive bumps.