The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 01, 2021

Filed:

Dec. 31, 2016
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Kevin L. Lin, Beaverton, OR (US);

Tayseer Mahdi, Hillsboro, OR (US);

Jessica M. Torres, Portland, OR (US);

Jeffery D. Bielefeld, Forest Grove, OR (US);

Marie Krysak, Portland, OR (US);

James M. Blackwell, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76885 (2013.01); H01L 21/7688 (2013.01); H01L 21/76829 (2013.01); H01L 21/76852 (2013.01); H01L 21/76883 (2013.01); H01L 21/76897 (2013.01);
Abstract

In an example, there is disclosed an integrated circuit, having: a first layer having a dielectric, a first conductive interconnect and a second conductive interconnect; a second layer having a third conductive interconnect; a conductive via between the first layer and the second layer to electrically couple the second conductive interconnect to the third conductive interconnect; and an etch-resistant plug disposed vertically between the first layer and second layer and disposed to prevent the via from electrically shorting to the first conductive interconnect.


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