The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 11, 2021

Filed:

Aug. 25, 2020
Applicant:

Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;

Inventors:

Vincent Chen, Taipei, TW;

Hung-Yi Kuo, Taipei, TW;

Chuei-Tang Wang, Taichung, TW;

Hao-Yi Tsai, Hsinchu, TW;

Chen-Hua Yu, Hsinchu, TW;

Wei-Ting Chen, Tainan, TW;

Ming Hung Tseng, Miaoli County, TW;

Yen-Liang Lin, Taichung, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 23/3107 (2013.01);
Abstract

A semiconductor structure includes a transceiver, a molding surrounding the transceiver, and a RDL disposed over the transceiver. The RDL includes an antenna and a dielectric layer. The antenna is disposed over and electrically connected to the transceiver. The dielectric layer surrounds the antenna. The antenna includes an elongated portion and a via portion. The elongated portion extends over the molding, and the via portion is electrically connected to the transceiver.


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