The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 11, 2021
Filed:
Jul. 17, 2019
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Meng-Che Tu, Hsinchu, TW;
Hung-Jui Kuo, Hsinchu, TW;
Yu-Hsiang Hu, Hsinchu, TW;
Sih-Hao Liao, New Taipei, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
An integrated fan-out (InFO) package includes a first redistribution structure, a die, an encapsulant, a plurality of through insulating vias (TIV), a plurality of dipole antennas, and a second redistribution structure. The die is disposed on the first redistribution structure. The encapsulant encapsulates the die. The TIVs and the dipole antennas are embedded in the encapsulant. Each dipole antenna includes a pair of antenna elements. Each antenna element has a first folded-sidewall and a second folded-sidewall opposite to the first folded-sidewall. A portion of each second folded-sidewall in the pair of antenna elements face each other. Each first folded-sidewall includes at least three sub-sidewalls connected to each other. The adjacent sub-sidewalls form an obtuse angle. The second redistribution structure is disposed on the die, the TIVs, the dipole antennas, and the encapsulant.