The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 27, 2021

Filed:

Jul. 30, 2019
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Tzu-Ching Lin, Hsinchu, TW;

Chien-Chih Lin, Taichung, TW;

Feng-Ching Chu, Pingtung, TW;

Tuoh Bin Ng, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8238 (2006.01); H01L 27/092 (2006.01); H01L 29/08 (2006.01); H01L 29/66 (2006.01); H01L 29/10 (2006.01);
U.S. Cl.
CPC ...
H01L 21/823821 (2013.01); H01L 21/823814 (2013.01); H01L 27/0924 (2013.01); H01L 29/0847 (2013.01); H01L 29/1054 (2013.01); H01L 29/6681 (2013.01);
Abstract

In an embodiment, a method includes: forming a first gate stack and a second gate stack on a fin; etching the fin to form a recess in the fin between the first gate stack and the second gate stack; forming an epitaxial source/drain region in the recess, the forming including: forming a first layer lining sides and a bottom of the recess by dispensing silane, dichlorosilane, trichlorosilane, and hydrochloric acid in the recess; and after forming the first layer, forming a second layer on the first layer by dispensing the silane, dichlorosilane, trichlorosilane, and hydrochloric acid in the recess, where each of the silane, dichlorosilane, trichlorosilane, and hydrochloric acid are dispensed at a first flow rate when forming the first layer and at a second flow rate when forming the second layer.


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