The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 13, 2021

Filed:

Nov. 22, 2017
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Ping Ping Ooi, Butterworth, MY;

Bok Eng Cheah, Bukit Gambir, MY;

Jackson Chung Peng Kong, Tanjung Tokong, MY;

Kooi Chi Ooi, Glugor, MY;

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0224 (2013.01); H01L 21/4857 (2013.01); H01L 23/4985 (2013.01); H01L 23/5383 (2013.01); H01L 25/0652 (2013.01); H01L 25/0657 (2013.01); H01L 24/85 (2013.01);
Abstract

A multi-conductor interconnect for a microelectronic device incorporates multiple conductors and integrated shielding for the conductors. The multi-conductor interconnect includes first and second groups of conductors interleaved with one another within a dielectric structure. One of the groups of conductors may be coupled to a reference voltage node to provide shielding for the other group of conductors. The multi-conductor interconnect may further include a shield layer extending over some portion, or all, of the conductors of the first and second groups.


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