The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 13, 2021

Filed:

Jan. 28, 2020
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Bok Eng Cheah, Bukit Gambir, MY;

Jackson Chung Peng Kong, Tanjung Tokong, MY;

Boon Ping Koh, Seberang Jaya, MY;

Kooi Chi Ooi, Glugor, MY;

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2006.01); H01L 23/498 (2006.01); H01L 25/00 (2006.01); H01Q 21/22 (2006.01); H01Q 1/52 (2006.01); H01Q 21/00 (2006.01); H01Q 1/22 (2006.01); H01L 23/00 (2006.01); H01L 23/66 (2006.01); H01L 23/552 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 25/16 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/5389 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01L 24/16 (2013.01); H01L 24/19 (2013.01); H01L 25/50 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/526 (2013.01); H01Q 21/0087 (2013.01); H01Q 21/22 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/16267 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/3025 (2013.01);
Abstract

A system-in-package includes a package substrate that at least partially surrounds an embedded radio-frequency integrated circuit chip and a processor chip mated to a redistribution layer. A wide-band phased-array antenna module is mated to the package substrate with direct interconnects from the radio-frequency integrated circuit chip to antenna patches within the antenna module. Additionally, fan-out antenna pads are also coupled to the radio-frequency integrated circuit chip.


Find Patent Forward Citations

Cheah, Bok. (2021). Systems in packages including wide-band phased-array antennas and methods of assembling same (U.S. Patent No. 10978434). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10978434

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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