The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 13, 2021
Filed:
Jan. 28, 2020
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Bok Eng Cheah, Bukit Gambir, MY;
Jackson Chung Peng Kong, Tanjung Tokong, MY;
Boon Ping Koh, Seberang Jaya, MY;
Kooi Chi Ooi, Glugor, MY;
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2006.01); H01L 23/498 (2006.01); H01L 25/00 (2006.01); H01Q 21/22 (2006.01); H01Q 1/52 (2006.01); H01Q 21/00 (2006.01); H01Q 1/22 (2006.01); H01L 23/00 (2006.01); H01L 23/66 (2006.01); H01L 23/552 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 25/16 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/5389 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01L 24/16 (2013.01); H01L 24/19 (2013.01); H01L 25/50 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/526 (2013.01); H01Q 21/0087 (2013.01); H01Q 21/22 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/16267 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/3025 (2013.01);
Abstract
A system-in-package includes a package substrate that at least partially surrounds an embedded radio-frequency integrated circuit chip and a processor chip mated to a redistribution layer. A wide-band phased-array antenna module is mated to the package substrate with direct interconnects from the radio-frequency integrated circuit chip to antenna patches within the antenna module. Additionally, fan-out antenna pads are also coupled to the radio-frequency integrated circuit chip.