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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10971492 B1

PDFFull Text
Date of Patent:
Apr. 06, 2021

Filed:

Apr. 22, 2020

Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same

Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Cheng Xu, Chandler, AZ (US);

Rahul Jain, Gilbert, AZ (US);

Seo Young Kim, Chandler, AZ (US);

Kyu Oh Lee, Chandler, AZ (US);

Ji Yong Park, Chandler, AZ (US);

Sai Vadlamani, Chandler, AZ (US);

Junnan Zhao, Gilbert, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:

Schwegman Lundberg & Woessner, P.A.

Primary Examiner:

William Coleman

Int. Cl.
CPC ...
H01L 27/07 (2006.01); H01L 23/64 (2006.01); H01L 23/522 (2006.01); H01L 23/00 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0788 (2013.01); H01L 23/5223 (2013.01); H01L 23/5227 (2013.01); H01L 23/642 (2013.01); H01L 23/645 (2013.01); H01L 24/09 (2013.01); H01L 28/10 (2013.01); H01L 28/40 (2013.01);
Abstract

Disclosed embodiments include an embedded thin-film capacitor and a magnetic inductor that are assembled in two adjacent build-up layers of a semiconductor package substrate. The thin-film capacitor is seated on a surface of a first of the build-up layers and the magnetic inductor is partially disposed in a recess in the adjacent build up layer. The embedded thin-film capacitor and the integral magnetic inductor are configured within a die shadow that is on a die side of the semiconductor package substrate.

Find Patent Forward Citations

Xu, Cheng. (2021). Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same (U.S. Patent No. 10971492). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10971492

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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