The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 30, 2021

Filed:

Dec. 20, 2019
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Fong-Yuan Chang, Hsinchu County, TW;

Kuo-Nan Yang, Hsinchu, TW;

Chung-Hsing Wang, Hsinchu County, TW;

Lee-Chung Lu, Taipei, TW;

Sheng-Fong Chen, Hsinchu County, TW;

Po-Hsiang Huang, Tainan, TW;

Hiranmay Biswas, Kolkata, IN;

Sheng-Hsiung Chen, Hsinchu County, TW;

Aftab Alam Khan, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/02 (2006.01); H01L 23/522 (2006.01); H01L 27/118 (2006.01); G06F 30/394 (2020.01);
U.S. Cl.
CPC ...
H01L 27/0207 (2013.01); G06F 30/394 (2020.01); H01L 23/5226 (2013.01); H01L 27/11807 (2013.01); H01L 2027/11881 (2013.01);
Abstract

An integrated circuit includes a cell layer, a first metal layer, a first conductive via, and a second conductive via. The cell layer includes first and second cells, in which the first cell is separated from the second cell by a non-zero distance. The first metal layer includes a first conductive feature and a second conductive feature, the first conductive feature overlaps the first cell and does not overlap the second cell, and the second conductive feature overlaps the second cell and does not overlap the first cell, in which the first conductive feature is aligned with the second conductive feature along lengthwise directions of the first and second conductive features. The first conductive via interconnects the cell layer and the first conductive feature of the first metal layer. The second conductive via interconnects the cell layer and the second conductive feature of the first metal layer.


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