The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2021

Filed:

Mar. 19, 2019
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Chien-Hua Lai, Taichung, TW;

Chia-Hung Kao, Keelung, TW;

Hsiu-Jen Wang, Taichung, TW;

Shih-Hao Kuo, Hsinchu, TW;

Yi-Sheng Liu, Tzubei, TW;

Shih-Hsien Lee, Hsinchu, TW;

Ching-Chang Chen, Tainan, TW;

Tsu-Hui Yang, Dongkung Town, TW;

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/20 (2006.01); G03F 9/00 (2006.01);
U.S. Cl.
CPC ...
G03F 9/7034 (2013.01); G03F 7/70383 (2013.01);
Abstract

Embodiments herein beneficially enable simultaneous processing of a plurality of substrates in a digital direct write lithography processing system. In one embodiment a method of processing a plurality of substrate includes positioning a plurality of substrates on a substrate carrier of a processing system, positioning the substrate carrier under the plurality of optical modules, independently leveling each of the plurality of substrates, determining offset information for each of the plurality of substrates, generating patterning instructions based on the offset information for each of the plurality of substrates, and patterning each of the plurality of substrates using the plurality of optical modules. The processing system comprises a base, a motion stage disposed on the base, the substrate carrier disposed on the motion stage, a bridge disposed above a surface of the base and separated therefrom, and a plurality of optical modules disposed on the bridge.


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