Keelung, Taiwan

Chia-Hung Kao

This inventor holds 3 USPTO granted patents. Top assignee: Applied Materials, Inc.. Active years: 2019-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chia-Hung Kao. Retrieved from https://idiyas.com/inventor/chia-hung-kao-gg119kgf

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 7.3

ph-index = 1


Company Filing History:


Years Active: 2019-2025

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3 patents (USPTO):Explore Patents

Title: Innovations of Chia-Hung Kao

Introduction

Chia-Hung Kao is a notable inventor based in Keelung, Taiwan. He has made significant contributions to the field of substrate handling systems and digital lithography processing. With a total of 3 patents to his name, Kao continues to push the boundaries of technology in his area of expertise.

Latest Patents

One of his latest patents is a "Multiple substrate handling system and method." This innovation provides a multi-substrate handling system equipped with an alignment apparatus that positions each substrate in predetermined orientations for transfer. The system includes a buffer chamber designed to receive and condition the substrates, along with a first transfer assembly that facilitates the transfer of substrates between the alignment apparatus and the buffer chamber. Additionally, a second transfer assembly with at least two robots is included to move the substrate carrier between the buffer chamber and a process chamber, which processes the substrates using varying parameters.

Another significant patent is related to "Multi-substrate processing on digital lithography systems." This invention allows for the simultaneous processing of multiple substrates in a digital direct write lithography processing system. The method involves positioning substrates on a carrier, leveling them independently, and generating patterning instructions based on offset information for each substrate. This innovative approach enhances the efficiency and effectiveness of substrate processing.

Career Highlights

Chia-Hung Kao is currently employed at Applied Materials, Inc., where he applies his expertise in substrate handling and lithography systems. His work has contributed to advancements in manufacturing processes and has had a positive impact on the industry.

Collaborations

Kao has collaborated with notable coworkers such as Shih-Hao Kuo and Hsiu-Jen Wang. Their combined efforts have led to innovative solutions in substrate processing and handling.

Conclusion

Chia-Hung Kao is a distinguished inventor whose work in substrate handling systems and digital lithography has made a significant impact on technology. His patents reflect his commitment to innovation and excellence in his field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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