Hsinchu, Taiwan

Shih-Hao Kuo


Average Co-Inventor Count = 5.3

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2019-2025

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7 patents (USPTO):Explore Patents

Title: Spotlight on Inventor Shih-Hao Kuo

Introduction

Shih-Hao Kuo is a prominent inventor based in Hsinchu, Taiwan, known for his innovative contributions to the field of digital lithography and advanced packaging technologies. With a portfolio of five patents, he has made significant strides in creating solutions that enhance manufacturing processes in semiconductor production.

Latest Patents

Kuo's latest patents reflect his dedication to improving efficiency and precision. One notable patent is the "Advanced-packaging high-volume-mode digital-lithography-tool." This invention outlines exemplary methods for packaging a substrate involving rotationally aligning it to a predetermined angular position, transferring it to a metrology station for topology measurement, and applying forces to flatten the substrate. These methods culminate in the adjustment of printing patterns based on die pattern mappings, ultimately improving substrate exposure during lithography processes.

Another significant invention is the "Dynamic imaging system," which provides solutions for compensating pattern defects caused by substrate warpage. This system includes an inspection mechanism that delivers 3D profile measurements and die shift measurements, enabling the generation of compensated exposure patterns to enhance output quality.

Career Highlights

Shih-Hao Kuo works at Applied Materials, Inc., a leader in materials engineering solutions that enhance the semiconductor manufacturing process. His work at this company has positioned him as a key figure in advancing lithography systems that support the precision needs of the industry.

Collaborations

Kuo collaborates closely with fellow inventors, including Hsiu-Jen Wang and Ching-Chang Chen. His teamwork with these professionals fosters a creative environment that drives innovation and accelerates the development of cutting-edge technologies in their field.

Conclusion

In conclusion, Shih-Hao Kuo's contributions to digital lithography and substrate packaging are invaluable to the semiconductor industry. His patents not only showcase his inventive capabilities but also highlight the collaborative spirit that drives advancements in technology. As he continues to innovate, the impact of his work will undoubtedly shape the future of semiconductor manufacturing.

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