The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 09, 2021

Filed:

Nov. 29, 2017
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Bok Eng Cheah, Bukit Gambir, MY;

Jackson Chung Peng Kong, Tanjung Tokong, MY;

Kooi Chi Ooi, Glugor, MY;

Ping Ping Ooi, Butterworth, MY;

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 23/00 (2006.01); H01L 23/48 (2006.01); H01L 27/06 (2006.01); H01L 27/08 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0652 (2013.01); H01L 23/481 (2013.01); H01L 24/09 (2013.01); H01L 27/0617 (2013.01); H01L 27/0805 (2013.01); H01L 2224/09183 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06541 (2013.01);
Abstract

Discussed generally herein are devices that can include multiple stacked dice electrically coupled to dice electrically coupled to a peripheral sidewall of the stacked dice and/or a dice stack electrically coupled to a passive die. In one or more embodiments a device can include a dice stack comprising at least two dice including a first die and a second die, the first die electrically connected to and on a second die, a first side pad on, or at least partially in, a first sidewall of the dice stack, a third die electrically connected to the first die at a first surface of the third die and through the first side pad, and a fourth die electrically connected to the third die at a second surface of the first die, the second side opposite the first side.


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