The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 15, 2020

Filed:

Mar. 06, 2019
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Wataru Takayama, Miyagi, JP;

Muneyuki Omi, Miyagi, JP;

Rei Ibuka, Miyagi, JP;

Dai Igarashi, Miyagi, JP;

Takayuki Suzuki, Miyagi, JP;

Takahiro Murakami, Miyagi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); H01L 21/67 (2006.01); B08B 7/00 (2006.01); H01L 21/687 (2006.01); H01L 21/683 (2006.01); H01L 21/311 (2006.01); H01L 21/8234 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32862 (2013.01); B08B 7/0035 (2013.01); H01J 37/3244 (2013.01); H01J 37/32724 (2013.01); H01L 21/31116 (2013.01); H01L 21/67069 (2013.01); H01L 21/67109 (2013.01); H01L 21/67248 (2013.01); H01L 21/67253 (2013.01); H01L 21/6831 (2013.01); H01L 21/68714 (2013.01); H01L 21/823468 (2013.01);
Abstract

A plasma processing method includes: plasma-processing a substrate placed on a surface of a placement table while causing a coolant of 0° C. or lower to flow through a coolant flow path formed inside the table; placing a dummy substrate on the surface of the placement table in place of the substrate; and removing a reaction product generated due to the plasma processing of the substrate by the plasma of the processing gas from a peripheral edge portion of the surface of the placement table while heating the surface of placement table by the plasma of the processing gas via the dummy substrate in a state where the dummy substrate is placed on the surface of the placement table.


Find Patent Forward Citations

Loading…