The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2020

Filed:

Apr. 24, 2017
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Shiyu Sun, Santa Clara, CA (US);

Nam Sung Kim, Sunnyvale, CA (US);

Bingxi Sun Wood, Cupertino, CA (US);

Naomi Yoshida, Sunnyvale, CA (US);

Sheng-Chin Kung, Milpitas, CA (US);

Miao Jin, San Jose, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 29/423 (2006.01); H01L 29/78 (2006.01); H01L 21/02 (2006.01); H01L 29/775 (2006.01); H01L 29/786 (2006.01); H01L 29/06 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 29/42392 (2013.01); H01L 21/02603 (2013.01); H01L 29/0653 (2013.01); H01L 29/66439 (2013.01); H01L 29/775 (2013.01); H01L 29/7848 (2013.01); H01L 29/78684 (2013.01); H01L 29/78696 (2013.01); H01L 29/0673 (2013.01);
Abstract

The present disclosure provides an apparatus and methods for forming nanowire structures with desired materials horizontal gate-all-around (hGAA) structures field effect transistor (FET) for semiconductor chips. In one example, a method of forming nanowire structures includes depositing a dielectric material on a first side and a second side of a stack. The stack may include repeating pairs of a first layer and a second layer. The first side is opposite the second side and the first side and the second side have one or more recesses formed therein. The method includes removing the dielectric material from the first side and the second side of the stack. The dielectric material remains in the one or more recesses. The method includes the deposition of a stressor layer and the formation of one or more side gaps between the stressor layer and the first side and the second side of the stack.


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