The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2020

Filed:

Nov. 08, 2019
Applicant:

Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;

Inventors:

Vincent Chen, Taipei, TW;

Hung-Yi Kuo, Taipei, TW;

Chuei-Tang Wang, Taichung, TW;

Hao-Yi Tsai, Hsinchu, TW;

Chen-Hua Yu, Hsinchu, TW;

Wei-Ting Chen, Tainan, TW;

Ming Hung Tseng, Miaoli County, TW;

Yen-Liang Lin, Taichung, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 23/3107 (2013.01);
Abstract

A semiconductor structure includes a transceiver, a molding surrounding the transceiver, a plurality of vias extending through the molding, and a RDL disposed over the transceiver and the plurality of vias. In some embodiments, the RDL includes an antenna disposed over and electrically connected to the transceiver, and a dielectric layer surrounding the antenna. In some embodiments, the antenna includes an elongated portion extending over the molding and a via portion electrically connected to the transceiver.


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