The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2020
Filed:
May. 15, 2018
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Li-Hsien Huang, Hsinchu County, TW;
An-Jhih Su, Taoyuan, TW;
Der-Chyang Yeh, Hsinchu, TW;
Hua-Wei Tseng, New Taipei, TW;
Yueh-Ting Lin, Taipei, TW;
Ming-Shih Yeh, Hsinchu County, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Abstract
A package structure including a semiconductor die, an insulating encapsulant, a redistribution layer and a plurality of conductive terminals is provided. The semiconductor die includes a semiconductor substrate, a plurality of conductive pads and a plurality of conductive strips. The conductive pads are disposed on and connected to the plurality of conductive pads, wherein each of the conductive strips is physically connected to at least two conductive pads. The insulating encapsulant is encapsulating the semiconductor die. The redistribution layer is disposed on the insulating encapsulant and the semiconductor die, wherein the redistribution layer is electrically connected to the plurality of conductive strips. The plurality of conductive terminals is disposed on the redistribution layer.