The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 2020

Filed:

Jun. 06, 2017
Applicant:

Versum Materials Us, Llc, Allentown, PA (US);

Inventors:

Xiaobo Shi, Chandler, AZ (US);

Joseph Rose, Chandler, AZ (US);

Timothy Joseph Clore, Chandler, AZ (US);

James Allen Schlueter, Phoenix, AZ (US);

Malcolm Grief, Phoenix, AZ (US);

Mark Leonard O'Neill, Queen Creek, AZ (US);

Assignee:

Versum Materials US, LLC, Tempe, AZ (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); B24B 37/04 (2012.01); C09K 3/14 (2006.01); C23F 3/04 (2006.01); H01L 21/321 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); B24B 37/044 (2013.01); C09K 3/1409 (2013.01); C23F 3/04 (2013.01); H01L 21/3212 (2013.01); H01L 21/7684 (2013.01);
Abstract

Chemical mechanical polishing (CMP) compositions, methods and systems for polish cobalt or cobalt-containing substrates are provided. The CMP compositions comprise α-alanine, abrasive particles, a salt of phosphate, corrosion inhibitor, oxidizer and water. The cobalt chemical mechanical polishing compositions provide high removal rate of Co as well as very high selectivity of Co film vs. dielectric film, such as TEOS, SixNy (with 1.0<x<3.0, 1.33<y<4.0), low-k, and ultra low-k films.


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