The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2020

Filed:

Dec. 16, 2015
Applicant:

Basf SE, Ludwigshafen, DE;

Inventors:

Robert Reichardt, Ludwigshafen am Rhein, DE;

Max Siebert, Ludwigshafen, DE;

Yongqing Lan, Ludwigshafen, DE;

Michael Lauter, Mannheim, DE;

Sheik Ansar Usman Ibrahim, Heverlee, BE;

Reza M Golzarian, Portland, OR (US);

Haci Osman Guevenc, Heidelberg, DE;

Julian Proelss, Worms, DE;

Leonardus Leunissen, Ludwigshafen, DE;

Assignee:

BASF SE, Ludwigshafen, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/321 (2006.01); H01L 21/306 (2006.01); H01L 21/304 (2006.01); H01L 21/302 (2006.01); C09K 3/14 (2006.01); C09G 1/04 (2006.01); C09G 1/02 (2006.01); C09G 1/00 (2006.01); C09D 7/63 (2018.01); C09D 5/00 (2006.01); C09D 133/08 (2006.01); C08K 5/5435 (2006.01); B24B 37/04 (2012.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); B24B 37/044 (2013.01); C09D 5/00 (2013.01); C09D 7/63 (2018.01); C09D 133/08 (2013.01); C09G 1/00 (2013.01); C09G 1/04 (2013.01); C09K 3/1409 (2013.01); C09K 3/1454 (2013.01); C09K 3/1463 (2013.01); H01L 21/302 (2013.01); H01L 21/304 (2013.01); H01L 21/30625 (2013.01); H01L 21/3212 (2013.01); C08K 5/5435 (2013.01);
Abstract

Use of a chemical mechanical polishing (CMP) composition for polishing of cobalt and/or co-balt alloy comprising substrates Abstract Use of a chemical mechanical polishing (CMP) composition (Q) for chemical mechanical polishing of a substrate (S) comprising (i) cobalt and/or (ii) a cobalt alloy, wherein the CMP composition (Q) comprises (A) Inorganic particles (B) a substituted tetrazole derivative of the general formula (I), wherein Ris H, hydroxy, alkyl, aryl, alkylaryl, amino, carboxyl, alkylcarboxyl, thio or alkylthio. (C) at least one amino acid (D) at least one oxidizer, (E) an aqueous medium and wherein the CMP composition (Q) has a pH of from 7 to 10.


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