logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10734333 B1

PDFFull Text
Date of Patent:
Aug. 04, 2020

Filed:

Jun. 15, 2016

Semiconductor package having inductive lateral interconnects

Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Jackson Chung Peng Kong, Tanjung Tokong, MY;

Bok Eng Cheah, Bukit Gambir, MY;

Khang Choong Yong, Puchong, MY;

Howard Lincoln Heck, Beaverton, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:

Schwabe, Williamson & Wyatt, P.C.

Primary Examiner:

S V Clark

Int. Cl.
CPC ...
H01L 23/42 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/66 (2006.01); H01L 23/498 (2006.01); H01L 23/525 (2006.01); H01L 21/48 (2006.01); H01L 23/64 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 21/486 (2013.01); H01L 23/49822 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 23/525 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 23/645 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6638 (2013.01); H01L 2223/6672 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/15311 (2013.01);
Abstract

Semiconductor packages including a lateral interconnect having an arc segment to increase self-inductance of a signal line is described. In an example, the lateral interconnect includes a circular segment extending around an interconnect pad. The circular segment may extend around a vertical axis of a vertical interconnect to introduce an inductive circuitry to compensate for an impedance mismatch of the vertical interconnect.

Find Patent Forward Citations

Kong, Jackson Chung Peng. (2020). Semiconductor package having inductive lateral interconnects (U.S. Patent No. 10734333). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10734333

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…