The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2020
Filed:
Aug. 15, 2018
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Kuo-Ming Wu, Zhubei, TW;
Ching-Chun Wang, Tainan, TW;
Dun-Nian Yaung, Taipei, TW;
Hsing-Chih Lin, Tainan, TW;
Jen-Cheng Liu, Hsin-Chu, TW;
Min-Feng Kao, Chiayi, TW;
Yung-Lung Lin, Taichung, TW;
Shih-Han Huang, Kaohsiung, TW;
I-Nan Chen, Taipei, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Abstract
A three-dimensional (3D) integrated circuit (IC) is provided. In some embodiments, a second IC die is bonded to a first IC die by a first bonding structure. The first bonding structure contacts a first interconnect structure of the first IC die and a second interconnection structure of the second IC die, and has a first portion and a second portion hybrid bonded together. A third IC die is bonded to the second IC die by a third bonding structure. The third bonding structure comprises a second TSV (through substrate via) disposed through the second substrate of the second IC die and includes varies bonding structures according to varies embodiments of the invention.