The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2020

Filed:

Jul. 16, 2018
Applicants:

United Microelectronics Corp., Hsin-Chu, TW;

Fujian Jinhua Integrated Circuit Co., Ltd., Quanzhou, Fujian Province, CN;

Inventors:

Li-Wei Feng, Kaohsiung, TW;

Ying-Chiao Wang, Changhua County, TW;

Shih-Fang Tzou, Tainan, TW;

Assignees:

UNITED MICROELECTRONICS CORP., Hsin-Chu, TW;

Fujian Jinhua Integrated Circuit Co., Ltd., Quanzhou, Fujian Province, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/49 (2006.01); H01L 27/108 (2006.01); H01L 23/535 (2006.01); H01L 29/423 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 27/10897 (2013.01); H01L 23/535 (2013.01); H01L 27/10885 (2013.01); H01L 27/10894 (2013.01); H01L 29/42364 (2013.01); H01L 29/4925 (2013.01); H01L 29/6656 (2013.01); H01L 29/6659 (2013.01);
Abstract

A semiconductor memory device includes a semiconductor substrate, a gate structure, a first spacer structure, and a gate connection structure. The semiconductor substrate includes a memory cell region and a peripheral region. The gate structure is disposed on the semiconductor substrate and disposed on the peripheral region. The gate structure includes a first conductive layer and a gate capping layer. The gate capping layer is disposed on the first conductive layer. The first spacer structure is disposed on a sidewall of the first conductive layer and a sidewall of the gate capping layer. The gate connection structure includes a first part and a second part. The first part penetrates the gate capping layer and is electrically connected with the first conductive layer. The second part is connected with the first part, and the second part is disposed on and contacts a top surface of the gate capping layer.


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