The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2020
Filed:
Sep. 19, 2018
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Sih-Hao Liao, New Taipei, TW;
Hung-Jui Kuo, Hsinchu, TW;
Yu-Hsiang Hu, Hsinchu, TW;
Meng-Che Tu, Hsinchu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/532 (2006.01); H01L 23/522 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01); H01L 21/768 (2006.01); H01L 21/02 (2006.01); C08L 33/08 (2006.01); C08L 79/08 (2006.01); C08L 65/00 (2006.01); C08K 5/42 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5329 (2013.01); C08K 5/42 (2013.01); C08L 33/08 (2013.01); C08L 65/00 (2013.01); C08L 79/08 (2013.01); H01L 21/02118 (2013.01); H01L 21/76801 (2013.01); H01L 23/3171 (2013.01); H01L 23/5226 (2013.01); H01L 23/53228 (2013.01); H01L 24/11 (2013.01); H01L 24/17 (2013.01); H01L 25/0655 (2013.01); H01L 2224/024 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/02379 (2013.01);
Abstract
Semiconductor devices, semiconductor packages and methods of forming the same are provided. One of the semiconductor device includes a dielectric layer and a connector. The dielectric layer includes a dielectric material and an additive, wherein the additive includes a compound represented by Chemical Formula 1. The connector is disposed in the dielectric layer.