The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2020

Filed:

Aug. 14, 2019
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Saptarshi Basu, San Jose, CA (US);

Jeongmin Lee, San Ramon, CA (US);

Paul Connors, San Mateo, CA (US);

Dale R. Du Bois, Los Gatos, CA (US);

Prashant Kumar Kulshreshtha, San Jose, CA (US);

Karthik Thimmavajjula Narasimha, San Francisco, CA (US);

Brett Berens, San Jose, CA (US);

Kalyanjit Ghosh, Pleasanton, CA (US);

Jianhua Zhou, Campbell, CA (US);

Ganesh Balasubramanian, Fremont, CA (US);

Kwangduk Douglas Lee, Redwood City, CA (US);

Juan Carlos Rocha-Alvarez, San Carlos, CA (US);

Hiroyuki Ogiso, Sunnyvale, CA (US);

Liliya Krivulina, Santa Clara, CA (US);

Rick Gilbert, San Jose, CA (US);

Mohsin Waqar, Alameda, CA (US);

Venkatanarayana Shankaramurthy, San Jose, CA (US);

Hari K. Ponnekanti, San Jose, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/40 (2006.01); H01L 21/67 (2006.01); H01J 37/32 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67069 (2013.01); H01J 37/32009 (2013.01); H01J 37/3244 (2013.01); H01J 37/32357 (2013.01); H01J 37/32366 (2013.01); H01J 37/32633 (2013.01); H01J 37/32715 (2013.01); H01L 21/6708 (2013.01); H01L 21/67201 (2013.01); H01L 21/68785 (2013.01); H01J 2237/334 (2013.01);
Abstract

Implementations disclosed herein describe a bevel etch apparatus within a loadlock bevel etch chamber and methods of using the same. The bevel etch apparatus has a mask assembly within the loadlock bevel etch chamber. During an etch process, the mask assembly delivers a gas flow to control bevel etch without the use of a shadow frame. As such, the edge exclusion at the bevel edge can be reduced, thus increasing product yield.


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