The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2020
Filed:
Aug. 11, 2017
Applied Materials, Inc., Santa Clara, CA (US);
Hiroyuki Ogiso, Sunnyvale, CA (US);
Jianhua Zhou, Campbell, CA (US);
Zonghui Su, San Jose, CA (US);
Juan Carlos Rocha-Alvarez, San Carlos, CA (US);
Jeongmin Lee, Sunnyvale, CA (US);
Karthik Thimmavajjula Narasimha, San Francisco, CA (US);
Rick Gilbert, San Jose, CA (US);
Sang Heon Park, Fremont, CA (US);
Abdul Aziz Khaja, San Jose, CA (US);
Vinay Prabhakar, Cupertino, CA (US);
APPLIED MATERIALS, INC., Santa Clara, CA (US);
Abstract
Implementations described herein generally relate to methods for leveling a component above a substrate. In one implementation, a test substrate is placed on a substrate support inside of a processing chamber. A component, such as a mask, is located above the substrate. The component is lowered to a position so that the component and the substrate are in contact. The component is then lifted and the particle distribution on the test substrate is reviewed. Based on the particle distribution, the component may be adjusted. A new test substrate is placed on the substrate support inside of the processing chamber, and the component is lowered to a position so that the component and the new test substrate are in contact. The particle distribution on the new test substrate is reviewed. The process may be repeated until a uniform particle distribution is shown on a test substrate.